Technology for improving heat dissipation performance using printed circuit technology.
For high-performance ceramic substrates, please consult our specialized manufacturer.
With the increase in brightness (high output) of LED elements, the importance of heat resistance in packaging materials has grown significantly, along with the demand for heat dissipation characteristics. We have received many inquiries regarding heat dissipation measures, particularly about "improving heat dissipation using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which have excellent heat dissipation properties." Our company applies unique printed circuit technology to process through-holes in alumina ceramic substrates and fills the through-hole sections with "special silver-based materials," achieving higher heat dissipation effects than typical alumina ceramic substrates.
- Company：共立エレックス
- Price：Other
